The recent news regarding AMD’s plan to introduce glass substrates between 2025 and 2026 has brought attention to the potential benefits of using glass substrates in chip and substrate fabrication. While this may not seem like an exciting topic at first glance, the implications for performance and efficiency improvements are significant.
One of the key advantages of using glass substrates is the potential for chiplet-to-chiplet and chip-to-motherboard communication. By using glass substrates instead of organic ones, there are a variety of benefits that can be achieved. These include allowing for more chiplets in a smaller footprint, higher interconnect density, faster IO, higher power efficiency, and larger package sizes.
In the case of AMD, chiplet-to-chiplet and chip-to-motherboard interconnects are essential components of its Infinity Architecture. The use of glass substrates can enhance this architecture by providing a flatter, more durable surface that allows for easier lithographic insertion of more densely packed interconnects. Considering the importance of this architecture to AMD’s products, it would make sense for the company to consider patenting this innovation as “Infinity Glass.”
According to reports from TrendForce, AMD is already conducting performance evaluation tests on glass substrate samples from major global semiconductor substrate companies. This indicates that AMD is actively working towards implementing this advanced substrate technology in semiconductor manufacturing. However, it is important to note that not all semiconductor substrate companies are near to mass production of glass substrates.
While the target timeline of 2025 or 2026 for introducing glass substrate chips to the market might seem ambitious, it aligns with the plans of other major players in the industry. Companies like Samsung and Intel are also aiming for glass substrate mass production around the same timeframe. AMD could potentially collaborate with these companies to ensure a smooth transition to using glass substrates in their products.
It is unlikely that glass substrates will be initially featured in the best gaming CPUs or regular desktop chips when they first come to market. The current focus seems to be on leveraging the benefits of glass substrates for big, multi-chip packages rather than individual consumer-grade processors. AMD’s EPYC lineup, which is targeted towards AI and HPC data centers, may be a more suitable candidate for implementing glass substrates due to its complex chiplet designs.
While AMD is known for its chiplet designs in gaming processors, the next generation of EPYC processors is expected to continue using regular organic substrates. This suggests that the window for the 2025 or 2026 prediction to become accurate may be limited. As advancements in chip and substrate fabrication continue to evolve, it will be interesting to see how glass substrates shape the future of semiconductor manufacturing.
Overall, the introduction of glass substrates in chip and substrate fabrication holds great potential for enhancing performance and efficiency in semiconductor products. As companies like AMD, Intel, and Samsung make progress towards mass production of glass substrates, the industry is poised for significant advancements in the coming years.
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